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  datasheet www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. switching diode BAS21HMFH aec-q101 qualified ? series ? dimensions (unit : mm) ? land size figure (unit : mm) high frequency switching ? application general rectification ? structure ? features 1) small power mold type (sot-23) ? taping dimensions (unit : mm) 2) high speed switching 3) high current overload capacity ? construction silicon epitaxial planar type ? absolute maximum ratings (t a = 25c) symbol unit repetitive peak reverse voltage v rm v reverse voltage v r v forward current i f ma repetitive peak forward current i frm ma power dissipation p tot mw operating junction temperature t j c storage temperature t stg c * 20mm x 20mm x 0.8mm, fr-4 both side is all covered with copper. ? electrical characteristics (t j = 25c) symbol min. typ. max. unit 0.75 0.93 1.0 v 0.8 1.05 1.25 v - - 100 na - - 100 ? a reverse recovery time t rr - - 50 ns terminal capacitance c t -2 . 5- p f thermal resistance r th(j-a) - - 250 c/w forward voltage reverse current v r =200v t j =25oc t j =150oc v f i r junction to ambient direct reverse voltage i f =100ma conditions -- direct forward current i f =200ma i f =30ma, i r =30ma, r l =100 ? , i rr =0.1i r v r =0v, f=1mhz parameter limits conditions parameter 200150 ? 55 to ? 150 625 200 i fsm non-repetitive forward surge current a tp Q 1s, duty Q 0.5 250 duty Q 0.5 glass epoxy mounted * 250 square wave , non-repetitive at t j =25oc t=1 s t=10ms 10 2 sot-23 rohm : ssd3 jedec : sot-23 0.80min 1.00min 1.90 2.40 cathode anode open 1/4 2016.06 - rev.a downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet BAS21HMFH ? electrical characteristic curves 0.1 1 10 100 0.001 0.01 0.1 1 10 100 t j = 25 c forward current : i f (a) forward voltage : v f (mv) v f -i f characteristics reverse current : i r (na) reverse voltage : v r (v) v r -i r characteristics capacitance between terminals : c t (pf) reverse voltage : v r (v) v r -c t characteristics i fsm time peak surge forward current : i fsm (a) time : t(ms) i fsm -t characteristics 0.01 0.1 1 10 100 1000 0 50 100 150 200 250 t j = 75 c t j = 25 c t j = 125 c t j = ? 40 c t j = 150 c 0.001 0.01 0.1 1 0 200 400 600 800 1000 1200 1400 1600 1800 t j = 75 c t j = 25 c t j = 125 c t j = ? 40 c t j = 150 c 0.1 1 10 0 5 10 15 20 25 30 t j = 25 c f = 1mhz 2/4 2016.06 - rev.a downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet BAS21HMFH ? electrical characteristic curves 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 03 06 09 01 2 01 5 0 d=0.5 d.c. half sin wave d=0.2 d=0.1 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 03 06 09 01 2 01 5 0 d=0.5 d.c. half sin wave d=0.2 d=0.1 t t j =150 c d=t/t t v r io v r =v rmax 0a 0v t t j =150 c d=t/t t v r io v r =v rmax 0a 0v transient thermal impedance : r th ( c/w) time : t(s) r th -t characteristics average rectified forward current : i o (a) ambient temperature : t a ( c) derating curve (i o -t a ) average rectified forward current : i o (a) case temperature : t c ( c) derating curve (i o -t c ) power dissipation : pd(%) ambient temperature : t a ( c) pd-ta characteristics 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000 r th(j-c) r th(j-a) 20mm x 20mm x 0.8mm glass epoxy(fr-4) both side is all covered with copper (35um thickness) 0 20 40 60 80 100 120 0 25 50 75 100 125 150 3/4 2016.06 - rev.a downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet BAS21HMFH ? electrical characteristic curves forward power dissipation : p f (w) average rectified forward current : i o (a) i o -p f characteristics 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 d=0.5 d.c. half sin wave d=0.2 d=0.1 t j = 150 c 4/4 2016.06 - rev.a downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class  class  class  b class  class ? class  2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///


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